South Korean semiconductor equipment company EO Technics stands out in laser drilling, a crucial process for the next-generation semiconductor substrate known as ‘glass substrate.’ The company’s equipment is currently being tested by a major semiconductor company in the United States. If the equipment passes technology certification successfully, EO Technics is poised to outpace major Japanese competitors and emerge as a key partner in the era of glass substrates.
According to industry insiders on Apr. 9, EO Technics is conducting performance verification tests on glass substrate UV drilling equipment in collaboration with a major U.S. semiconductor firm. EO Technics is currently discussing the supply of glass substrate equipment that uses UV lasers to form micro-holes at the micrometer level, facilitating the smooth transmission of electrical signals between 3D-structured chips.
The UV driller developed by EO Technics, in particular, is noted for its higher precision than the CO2 drillers that Japanese firms predominantly offer. The industry views UV drilling as the new standard as semiconductor processes become more complex and evolve into 3D structures. Experts predict UV drilling will become essential for ultra-precision substrates with less than 10 micrometers of semiconductor line widths.
As a comprehensive laser specialist, EO Technics develops and manufactures lasers and equipment for semiconductor and display manufacturing, printed circuit boards (PCBs), and large-scale processes such as secondary battery production. Laser marking commands a 95% share of the local market and 60-70% of the international market. Laser markers mark manufacturers and manufacturing dates on wafers, packages, and PCBs. The company is expanding its presence in the laser application equipment market by leveraging its core technologies.
