SK Group and TSMC have once again joined forces to strengthen their partnership.
SK Group’s Chairman Chey Tae-won and SK Hynix’s CEO Kwak Noh-jung have decided to strengthen cooperation with TSMC, the world’s largest semiconductor foundry company, to enhance their competitiveness in AI semiconductors.
According to SK Group on Jun. 7, Chairman Chey met with key figures in Taiwan’s IT industry, including TSMC Chairman C. C. Wei, on Jun. 6 (local time) to discuss collaboration in the AI and semiconductor sectors. Chairman Chey expressed a desire to “jointly lay the groundwork for an AI era that benefits humanity.” Both parties agreed to enhance cooperation between SK Hynix and TSMC in the development of high-bandwidth memory (HBM).
This is not the first time that SK Hynix has expanded its cooperation with TSMC; it has done so continuously.
In Apr. SK Hynix signed a memorandum of understanding (MOU) with TSMC for technological cooperation to enhance its capabilities in HBM4 (6th generation HBM) development and advanced packaging technologies.
SK Hynix plans to utilize TSMC’s cutting-edge logic process for the production of base dies starting with HBM4 to improve performance. Based on this cooperation, the company aims to begin mass production of HBM4 in 2025.
