Advanced packaging technologies and high-bandwidth memory (HBM) have fueled a surge in global chip demand. Beneath the surface, the semiconductor industry is now locked in an intense race for the next big chip technology.
This shift comes as HBM and chip-on-wafer-on-substrate (CoWoS) technology growth has begun to slow amid issues related to overheating, power consumption, and cost challenges taking hold. Chipmakers and component manufacturers are looking beyond the current Nvidia-TSMC-dominated market, ramping up research and development of next-generation alternatives. Among these, glass substrates are gaining traction as a breakthrough solution.
South Korean semiconductor and component companies such as Samsung Electronics, Samsung Electro-Mechanics, SKC, and LG Innotek are developing glass substrate technology. Equipment makers, including Philoptics, EO Technics, and HB Technology, have also entered the glass substrate business. Globally, leading semiconductor companies like Intel, AMD, and Broadcom have established roadmaps for glass substrate development and are working toward mass production.
Fabless chip developer Nvidia and foundry (contract manufacturing) giant TSMC dominate the global semiconductor market. However, persistent shortages in supply relative to demand have raised concerns about an AI chip bubble. The technical limitations of the Nvidia-TSMC duopoly are also becoming increasingly apparent.
The advent of HBM and CoWoS technology initially overcame the constraints of Moore’s Law, but as the industry moves into the HBM3E (fifth-generation HBM) era, managing heat and power consumption has become a significant challenge, forcing the industry to seek alternatives.
Glass substrates have emerged as a promising solution. Unlike conventional silicon or organic substrates, glass substrates have lower thermal expansion rates, making them highly resistant to warpage at high temperatures. Glass substrates can also transmit up to 10 times more electrical signals in the same area, significantly reducing power consumption. As the size of chips continues to shrink while requiring more computing power, glass substrates could offer a way to address potential technical bottlenecks.
“If glass substrates emerge as the breakthrough solution, driving new technological innovations, we may witness an “underdog revolution” that challenges the Nvidia-TSMC duopoly,” said Kim Jong-min, an analyst at Samsung Securities. “Precedents have shown that challengers can upend industry leaders with breakthrough technologies, as seen with smartphones, GPUs, and even HBM.”
Contrary to earlier projections that glass substrate technology would require more than a decade to take shape before widespread adoption, development is progressing rapidly. AMD plans to replace silicon interposers with glass substrates in its high-performance chips by 2028, with prototype production possibly starting as early as next year. Broadcom is already conducting performance tests to integrate glass substrates into its chips. Intel has invested $1 billion in glass substrate development, aiming for mass production by 2030.
Korean chipmakers, materials companies, and equipment makers are also strengthening their efforts to develop glass substrate technology. Samsung Electronics is building a supply chain dedicated to glass substrates, while SKC plans to produce glass substrates through its subsidiary Absolix. LG Innotek has established a production roadmap with key subcontractors, and Samsung Electro-Mechanics intends to begin making glass substrates in-house production once its production facilities are complete.
Equipment makers are also investing in glass substrates. Philoptics is developing equipment for through-glass vias (TGV), ABF film attachment, and singulation processes, while GigaVis is focusing on advanced inspection equipment. EO Technics supplies UV drillers for glass substrates, and HB Technology is venturing into post-processing repair equipment for the sector.
“If companies like Intel and AMD successfully implement glass substrates in memory chips, we could see groundbreaking innovations across semiconductor packaging and advanced nodes,” said an industry insider.
