SK Hynix’s HBM3E 12-layer product, the world’s first to enter mass production. SK Hynix is ramping up efforts to diversify its supplier network for critical equipment used in high-bandwidth memory (HBM) production, aiming to reduce costs and secure a more stable supply chain. / News1
SK Hynix’s HBM3E 12-layer product, the world’s first to enter mass production. SK Hynix is ramping up efforts to diversify its supplier network for critical equipment used in high-bandwidth memory (HBM) production, aiming to reduce costs and secure a more stable supply chain. / News1

SK Hynix is diversifying its suppliers for the crucial TC bonder equipment, a key technology for manufacturing high-bandwidth memory (HBM). While Hanmi Semiconductor has been the primary supplier for this equipment, SK Hynix is now preparing to introduce equipment from Singapore’s ASMPT and Hanwha Precision Machinery to reduce costs and stabilize its supply chain.

According to industry sources, Hanwha Precision Machinery’s TC bonder equipment is in the final stages of quality testing for SK Hynix. It is expected that SK Hynix will finalize supply discussions with Hanwha Precision Machinery later this year. The TC bonder is essential equipment that attaches semiconductor chips to circuit boards using thermal compression, playing a critical role in determining the yield of HBM manufacturing, particularly the process of stacking multiple DRAM chips.

Since 2017, Hanmi Semiconductor, which co-developed the TC bonder with SK Hynix, has been the exclusive supplier for HBM manufacturing equipment.

As SK Hynix, the leader in the HBM market, expanded its production capacity, Hanmi Semiconductor’s operating profits also surged. In Q3 of this year, Hanmi Semiconductor posted a record-breaking operating profit of 99.3 billion won ($72.4 million), more than 30 times the $2.1 million from the same period last year. According to financial information provider FnGuide, Hanmi Semiconductor’s annual operating profit is projected to reach $193.9 million, an eightfold increase from the previous year’s $25.2 million.

Hanmi Semiconductor’s dual TC bonder for HBM (High Bandwidth Memory) production. / Hanmi Semiconductor

However, with the upcoming mass production of the HBM3E, which involves a 12-layer stacking process, SK Hynix has opted for a multi-vendor strategy to ensure a stable supply of TC bonder equipment.

In the face of slowing price growth for general memory semiconductors due to the IT market downturn, SK Hynix is focusing on reducing costs and maximizing profits from HBM, which is used in AI accelerators. Also, if SK Hynix relies on a single supplier, it could face issues, as any delays from that supplier may disrupt production schedules.

A source familiar with SK Hynix’s operations said, “Since early this year, SK Hynix has been testing TC bonder equipment from Hanwha Precision Machinery to check for quality issues. The equipment is expected to be integrated into production lines as early as this year, with ASMPT’s equipment also under consideration.” The source added, “Relying on a sole vendor for key equipment in a next-generation business like HBM carries inherent risks, so the shift to a multi-vendor strategy was inevitable.”

Kang Sung-chul, a professor at UNIST’s emphasized the importance of diversifying suppliers, saying, “For semiconductor manufacturers, diversifying suppliers is a natural step to reduce costs and stabilize the supply chain. For SK Hynix, ensuring timely mass production of HBM for clients like Nvidia is crucial, making it essential to secure multiple equipment sources.”

SK Hynix is particularly focused on minimizing wafer warpage, which becomes more pronounced in the 12-layer stacking process of HBM3E, unlike the previous 8-layer version. The company has already begun trial production with a small supply of ASMPT equipment and is conducting quality tests on Hanwha Precision Machinery’s equipment to determine the next steps.